This is a blank breakout board with a surface-mount pattern for SSOP devices up to 28 pins. Two rows of through-hole pads are provided, on 0.1" centers, to accommodate standard 0.025" square pins, round pins, or wires. Distance between the two rows of through-hole pads is 0.6", designed to plug into a standard wide DIP socket or a solderless breadboard. Manufactured by ETT (Thailand).
Features:
- suitable for use with any chip supplied in a 20-pin to 28-pin SSOP package (250 mil nominal body width)
- direct one-to-one pin-numbering
- solder-masked and plated for easier chip mounting